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ISBN10: 0471574813, ISBN13: 9780471574811, [publisher: John Wiley & Sons] Hardcover Q.-Y. TONG is Professor and Director of the Microelectronics Center at Southeast University in Nanjing, China, and Adjunct Professor at Duke University s School of Engineering. Currently, he is also the manager of the Wafer Bonding Lab at the Research Trian. [Greven, Germany] [Publication Year: 1998]
ISBN10: 0471574813, ISBN13: 9780471574811, [publisher: Wiley-Interscience] Hardcover Buy with confidence! Book is in good condition with minor wear to the pages, binding, and minor marks within [Amherst, NY, U.S.A.] [Publication Year: 1998]
Wiley-Interscience, Date: 1998-11-23. Hardcover. New. New. In shrink wrap. Looks like an interesting title! 1998. Wiley-Interscience ISBN 0471574813 9780471574811 [US]
ISBN10: 0471574813, ISBN13: 9780471574811, [publisher: Wiley-Blackwell] Hardcover New Book. Shipped from UK. Established seller since 2000. [Fairford, GLOS, United Kingdom] [Publication Year: 1998]
ISBN10: 0471574813, ISBN13: 9780471574811, [publisher: John Wiley & Sons] Hardcover Q.-Y. TONG is Professor and Director of the Microelectronics Center at Southeast University in Nanjing, China, and Adjunct Professor at Duke University s School of Engineering. Currently, he is also the manager of the Wafer Bonding Lab at the Research Trian. [Greven, Germany] [Publication Year: 1998]
Wiley-Blackwell 12/18/1998 12: 00: 00 AM Hardcover PLEASE NOTE, WE DO NOT SHIP TO DENMARK. New Book. Shipped from UK in 4 to 14 days. Established seller since 2000. Please note we cannot offer an expedited shipping service from the UK.
Wiley-Blackwell 12/18/1998 12: 00: 00 AM Hardcover PLEASE NOTE, WE DO NOT SHIP TO DENMARK. New Book. Shipped from UK in 4 to 14 days. Established seller since 2000. Please note we cannot offer an expedited shipping service from the UK.
ISBN10: 0471574813, ISBN13: 9780471574811, [publisher: Wiley-Interscience] Hardcover New. Fast Shipping and good customer service [Fayetteville, TX, U.S.A.] [Publication Year: 1998]
ISBN10: 0471574813, ISBN13: 9780471574811, [publisher: John Wiley & Sons Inc] Hardcover First Edition Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field. Series: ECS Series of Texts and Monographs. Num Pages: 320 pages, illustrations. BIC Classification: PHFC; PNRH; TGMT; TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 243 x 165 x 23. Weight in Grams: 598. . 1998. 1st Edition. Hardcover. . . . . [Galway, GY, Ireland] [Publication Year: 1998]
ISBN10: 0471574813, ISBN13: 9780471574811, [publisher: John Wiley & Sons Inc, New York] Hardcover First Edition Hardcover. A one-stop resource on all aspects of semiconductor wafer bonding for materials scientists and electrical engineers Semiconductor Wafer Bonding addresses the entire spectrum of mainstream and likely future applications of wafer bonding. It examines all of the important issues surrounding this technology, including basic interactions between flat surfaces, the influence of particles, surface steps and cavities, surface preparation and room-temperature wafer bonding, thermal treatment of bonded wafer pairs, and much more. This unique, one-stop resource consolidates information previously available only by time-consuming searches through technical journals, proceedings, and book chapters for more than 1,000 published articles on wafer bonding. It covers all materials used for wafer bonding-including silicon, III-V compounds, fused and crystalline quartz, glass, silicon carbide, sapphire, ferroelectrics, and many others. For materials scientists and electrical engineers who need to exploit the potential of this flourishing technology, Semiconductor Wafer Bonding is a convenient one-stop resource for answers to many common questions. It is also an excellent text/reference for graduate students eager to learn about this interdisciplinary field, which spans surface chemistry, solid-state physics, materials science, and electrical engineering. Though ...
ISBN10: 0471574813, ISBN13: 9780471574811, [publisher: John Wiley & Sons Inc] Hardcover Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field. Series: ECS Series of Texts and Monographs. Num Pages: 320 pages, illustrations. BIC Classification: PHFC; PNRH; TGMT; TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 243 x 165 x 23. Weight in Grams: 598. . 1998. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland. [Olney, MD, U.S.A.] [Publication Year: 1998]
ISBN10: 0471574813, ISBN13: 9780471574811, [publisher: Wiley-Interscience] Hardcover New Copy. Customer Service Guaranteed [Denver, CO, U.S.A.] [Publication Year: 1998]
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