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ISBN10: 3211728600, ISBN13: 9783211728604, [publisher: Springer] Hardcover New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service. [Irving, TX, U.S.A.] [Publication Year: 2007]
ISBN10: 3211728600, ISBN13: 9783211728604, [publisher: Springer] Hardcover New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service. [Irving, TX, U.S.A.] [Publication Year: 2007]
ISBN10: 3211728600, ISBN13: 9783211728604, [publisher: Springer] Hardcover New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service. [Irving, TX, U.S.A.] [Publication Year: 2007]
ISBN10: 3211728600, ISBN13: 9783211728604, [publisher: Springer] Hardcover New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service. [Irving, TX, U.S.A.] [Publication Year: 2007]
ISBN10: 3211728600, ISBN13: 9783211728604, [publisher: Springer Vienna] Hardcover Druck auf Anfrage Neuware - Printed after ordering - The 'Twelfth International Conference on Simulation of Semiconductor Processes and Devices' (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presenta tion and discussion of outstanding recent advances and developments in the field of numerical process and device simulation. Driven by the ongoing miniaturization in semiconductor fabrication technology, the variety of topics discussed at this meeting reflects the ever-growing complexity of the subject. Apart from the classic topics like process, device, and interconnect simulation, mesh generation, a broad spec trum of numerical issues, and compact modeling, new simulation approaches like atomistic and first-principles methods have emerged as important fields of research and are currently making their way into standard TCAD suites. [Einbeck, Germany] [Publication Year: 2007] ...
ISBN10: 3211728600, ISBN13: 9783211728604, [publisher: Springer Vienna] Hardcover Druck auf Anfrage Neuware - Printed after ordering - The 'Twelfth International Conference on Simulation of Semiconductor Processes and Devices' (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presenta tion and discussion of outstanding recent advances and developments in the field of numerical process and device simulation. Driven by the ongoing miniaturization in semiconductor fabrication technology, the variety of topics discussed at this meeting reflects the ever-growing complexity of the subject. Apart from the classic topics like process, device, and interconnect simulation, mesh generation, a broad spec trum of numerical issues, and compact modeling, new simulation approaches like atomistic and first-principles methods have emerged as important fields of research and are currently making their way into standard TCAD suites. [Einbeck, Germany] [Publication Year: 2007] ...
New. New Book; Fast Shipping from UK; Not signed; Not First Edition; The Simulation of Semiconductor Processes and Devices 2007 : SISPAD 2007. ISBN 3211728600 9783211728604 [GB]
. Ed(s): Grasser, Tibor (Technical University of Vienna, Austria); Selberherr, Siegfried
USD
238.82
Kennys Bookshop and Art Galleries Ltd. /Abebooks
ISBN10: 3211728600, ISBN13: 9783211728604, [publisher: Springer Verlag GmbH] Softcover Contains the proceedings of the 12th edition of the International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2007, held September 2007 in Austria. This volume provides a forum for the presentation of developments in the theoretical description and numerical simulation of semiconductor fabrication processes. Editor(s): Grasser, Tibor (Technical University of Vienna, Austria); Selberherr, Siegfried. Num Pages: 463 pages, biography. BIC Classification: TJFD5. Category: (UP) Postgraduate, Research & Scholarly. Dimension: 244 x 170 x 24. Weight in Grams: 759. . 2007. Paperback. . . . . [Galway, GY, Ireland] [Publication Year: 2007]
. Ed(s): Grasser, Tibor (Technical University of Vienna, Austria); Selberherr, Siegfried
USD
280.18
Kennys Bookstore /Abebooks
ISBN10: 3211728600, ISBN13: 9783211728604, [publisher: Springer Verlag GmbH] Softcover Contains the proceedings of the 12th edition of the International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2007, held September 2007 in Austria. This volume provides a forum for the presentation of developments in the theoretical description and numerical simulation of semiconductor fabrication processes. Editor(s): Grasser, Tibor (Technical University of Vienna, Austria); Selberherr, Siegfried. Num Pages: 463 pages, biography. BIC Classification: TJFD5. Category: (UP) Postgraduate, Research & Scholarly. Dimension: 244 x 170 x 24. Weight in Grams: 759. . 2007. Paperback. . . . . Books ship from the US and Ireland. [Olney, MD, U.S.A.] [Publication Year: 2007]
SR-ECOMMERCE. New. SR-ECOMMERCE ISBN 3211728600 9783211728604 [IN]
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When you click on links to various merchants on this site and make a purchase, this can result in this site earning a commission at no extra cost to you. Affiliate programs and affiliations include, but are not limited to, the eBay Partner Network, Amazon and Alibris.
