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1. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability. Buy it!

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Pecht, Michael:

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26.95

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books4less (Versandantiquariat Petra Gros GmbH & Co. KG) /ZVAB

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ISBN10: 0471594466, ISBN13: 9780471594468, [publisher: John Wiley & Sons;] Hardcover 426 Seiten; Das hier angebotene Buch stammt aus einer teilaufgelösten wissenschaftlichen Bibliothek und trägt die entsprechenden Kennzeichnungen (Rückenschild, Instituts-Stempel.); Schnitt und Einband sind etwas staubschmutzig; der Buchzustand ist ansonsten ordentlich und dem Alter entsprechend gut. Text in ENGLISCHER Sprache! Sprache: Englisch Gewicht in Gramm: 840
[Welling, Germany] [Publication Year: 1994]

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2. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability. Buy it!

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Pecht, Michael:

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29.78

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3. Integrated Circuit Hybrid and Multichip Module Package Design Guidelines Buy it!

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Pecht Michael

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42.27

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Harropian Books, IOBA /Biblio

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New York: Wiley-Interscience, Date: 1994. First Edition, Second Printing. Hardcover. Near Fine/Near Fine. Blue cloth over boards with title stamped in orange onto upper board and spine, 8vo, pp. xxxi, 426, illustrated with charts, tables and diagrams. Clean and unmarked throughout with light wear to jacket. 1994. Wiley-Interscience ISBN 0471594466 9780471594468 [CA]

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4. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines Buy it!

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Pecht, Michael

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42.98

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Harropian Books, IOBA /Abebooks

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ISBN10: 0471594466, ISBN13: 9780471594468, [publisher: Wiley-Interscience, New York] Hardcover First Edition Blue cloth over boards with title stamped in orange onto upper board and spine, 8vo, pp. xxxi, 426, illustrated with charts, tables and diagrams. Clean and unmarked throughout with light wear to jacket.
[Nelson, BC, Canada] [Publication Year: 1994]

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5. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: a Focus on Reliability Buy it!

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Pecht, Michael

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164.15

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HPB-Red via Alibris /Alibris

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Wiley-Interscience 1994 Hardcover Good Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!

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6. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability Buy it!

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Pecht, Michael

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164.15

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ISBN10: 0471594466, ISBN13: 9780471594468, [publisher: Wiley-Interscience] Hardcover Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
[Dallas, TX, U.S.A.] [Publication Year: 1994]

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7. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability Buy it!

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Pecht, Michael

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182.90

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Alibris /Alibris

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New York, NY Wiley-Interscience 1994 Hard cover New. Sewn binding. Cloth over boards. 464 p. Contains: Unspecified.

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8. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines:A Focus on Reliability Buy it!

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Pecht, Michael

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185.84

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GreatBookPricesUK /AbebooksUK

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ISBN10: 0471594466, ISBN13: 9780471594468, [publisher: Wiley-Interscience] Hardcover
[Castle Donington, DERBY, United Kingdom] [Publication Year: 1994]