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1. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability Buy it!

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Pecht, Michael
author size:
USD
182.90
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Alibris /Alibris
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New York, NY Wiley-Interscience 1994 Hard cover New. Sewn binding. Cloth over boards. 464 p. Contains: Unspecified.
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2. Integrated Circuit a Focus on Reliability Buy it!

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M Pecht
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USD
189.80
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Books2anywhere via Alibris /Alibris
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John Wiley & Sons 3/16/1994 12: 00: 00 AM Hardcover PLEASE NOTE, WE DO NOT SHIP TO DENMARK. New Book. Shipped from UK in 4 to 14 days. Established seller since 2000. Please note we cannot offer an expedited shipping service from the UK.
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3. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability. Buy it!

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Pecht, Michael:
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USD
29.78
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books4less (Versandantiquariat Petra Gros GmbH & Co. KG) /AbebooksDE
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ISBN10: 0471594466, ISBN13: 9780471594468, [publisher: John Wiley & Sons;] Hardcover 426 Seiten; Das hier angebotene Buch stammt aus einer teilaufgelösten wissenschaftlichen Bibliothek und trägt die entsprechenden Kennzeichnungen (Rückenschild, Instituts-Stempel.); Schnitt und Einband sind etwas staubschmutzig; der Buchzustand ist ansonsten ordentlich und dem Alter entsprechend gut. Text in ENGLISCHER Sprache! Sprache: Englisch Gewicht in Gramm: 840
[Welling, Germany] [Publication Year: 1994]
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4. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability. Buy it!

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Pecht, Michael:
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USD
26.95
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books4less (Versandantiquariat Petra Gros GmbH & Co. KG) /ZVAB
dealer size:
ISBN10: 0471594466, ISBN13: 9780471594468, [publisher: John Wiley & Sons;] Hardcover 426 Seiten; Das hier angebotene Buch stammt aus einer teilaufgelösten wissenschaftlichen Bibliothek und trägt die entsprechenden Kennzeichnungen (Rückenschild, Instituts-Stempel.); Schnitt und Einband sind etwas staubschmutzig; der Buchzustand ist ansonsten ordentlich und dem Alter entsprechend gut. Text in ENGLISCHER Sprache! Sprache: Englisch Gewicht in Gramm: 840
[Welling, Germany] [Publication Year: 1994]
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5. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability Buy it!

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Pecht, Michael
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USD
234.71
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Booksplease via Alibris /Alibris
dealer size:
New York, NY Wiley-Interscience 1994 Hard cover New. Sewn binding. Cloth over boards. 464 p. Contains: Unspecified.
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6. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability Buy it!

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Pecht, Michael
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USD
205.66
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Brook Bookstore /Abebooks
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ISBN10: 0471594466, ISBN13: 9780471594468, [publisher: Wiley-Interscience] Hardcover
[Milano, MI, Italy] [Publication Year: 1994]
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7. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability Buy it!

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Pecht, Michael
author size:
USD
234.00
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California Books /Abebooks
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ISBN10: 0471594466, ISBN13: 9780471594468, [publisher: Wiley-Interscience] Hardcover
[Miami, FL, U.S.A.] [Publication Year: 1994]
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8. Integrated Circuit Buy it!

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Pecht
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USD
213.89
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Chiron Media /AbebooksUK
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ISBN10: 0471594466, ISBN13: 9780471594468, [publisher: John Wiley & Sons 1994-02-15] Hardcover
[Wallingford, United Kingdom] [Publication Year: 1994]
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9. Integrated Circuit Hybrid and Multichip Module Package Design Guidelines Buy it!

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Michael Pecht
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USD
210.54
price size:
Cold Books /Biblio
dealer size:
John Wiley & Sons , pp. 426 . Hardback. New. John Wiley & Sons ISBN 0471594466 9780471594468 [US]
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10. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines:A Focus on Reliability Buy it!

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Pecht, Michael
author size:
USD
200.31
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GreatBookPrices /Abebooks
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ISBN10: 0471594466, ISBN13: 9780471594468, [publisher: Wiley-Interscience] Hardcover
[Columbia, MD, U.S.A.] [Publication Year: 1994]
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11. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines:A Focus on Reliability Buy it!

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Pecht, Michael
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USD
185.84
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GreatBookPricesUK /AbebooksUK
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ISBN10: 0471594466, ISBN13: 9780471594468, [publisher: Wiley-Interscience] Hardcover
[Castle Donington, DERBY, United Kingdom] [Publication Year: 1994]
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12. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines Buy it!

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Pecht, Michael
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USD
42.98
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Harropian Books, IOBA /Abebooks
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ISBN10: 0471594466, ISBN13: 9780471594468, [publisher: Wiley-Interscience, New York] Hardcover First Edition Blue cloth over boards with title stamped in orange onto upper board and spine, 8vo, pp. xxxi, 426, illustrated with charts, tables and diagrams. Clean and unmarked throughout with light wear to jacket.
[Nelson, BC, Canada] [Publication Year: 1994]
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13. Integrated Circuit Hybrid and Multichip Module Package Design Guidelines Buy it!

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Pecht Michael
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USD
42.27
price size:
Harropian Books, IOBA /Biblio
dealer size:
New York: Wiley-Interscience, Date: 1994. First Edition, Second Printing. Hardcover. Near Fine/Near Fine. Blue cloth over boards with title stamped in orange onto upper board and spine, 8vo, pp. xxxi, 426, illustrated with charts, tables and diagrams. Clean and unmarked throughout with light wear to jacket. 1994. Wiley-Interscience ISBN 0471594466 9780471594468 [CA]
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14. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: a Focus on Reliability Buy it!

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Pecht, Michael
author size:
USD
164.15
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HPB-Red via Alibris /Alibris
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Wiley-Interscience 1994 Hardcover Good Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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15. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability Buy it!

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Pecht, Michael
author size:
USD
164.15
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HPB-Red /Abebooks
dealer size:
ISBN10: 0471594466, ISBN13: 9780471594468, [publisher: Wiley-Interscience] Hardcover Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
[Dallas, TX, U.S.A.] [Publication Year: 1994]
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16. Integrated Circuit, Hybrid and Multichip Module Package Design Buy it!

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Michael Pecht
author size:
USD
252.68
price size:
Kennys Bookshop and Art Galleries Ltd. /Abebooks
dealer size:
ISBN10: 0471594466, ISBN13: 9780471594468, [publisher: John Wiley and Sons Ltd] Hardcover Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this booka s microelectronic package design--for--reliability guidelines and approaches essential for achieving their life--cycle, cost--effectiveness, and on--time delivery goals. Num Pages: 464 pages, bibliography. BIC Classification: TGPR; TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (XV) Technical / Manuals. Dimension: 238 x 163 x 31. Weight in Grams: 840. . 1994. Hardcover. . . . .
[Galway, GY, Ireland] [Publication Year: 1994]
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17. Integrated Circuit, Hybrid and Multichip Module Package Design Buy it!

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Michael Pecht
author size:
USD
308.92
price size:
Kennys Bookstore /Abebooks
dealer size:
ISBN10: 0471594466, ISBN13: 9780471594468, [publisher: John Wiley and Sons Ltd] Hardcover Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this booka s microelectronic package design--for--reliability guidelines and approaches essential for achieving their life--cycle, cost--effectiveness, and on--time delivery goals. Num Pages: 464 pages, bibliography. BIC Classification: TGPR; TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (XV) Technical / Manuals. Dimension: 238 x 163 x 31. Weight in Grams: 840. . 1994. Hardcover. . . . . Books ship from the US and Ireland.
[Olney, MD, U.S.A.] [Publication Year: 1994]
description size:
18. Integrated Circuit, Hybrid and Multichip Module Package Design Buy it!

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Michael Pecht
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USD
267.24
price size:
Kennys.ie via Alibris /Alibris
dealer size:
New Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this booka s microelectronic package design--for--reliability guidelines and approaches essential for achieving their life--cycle, cost--effectiveness, and on--time delivery goals. Num Pages: 464 pages, bibliography. BIC Classification: TGPR; TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (XV) Technical / Manuals. Dimension: 238 x 163 x 31. Weight in Grams: 840. 1994. Hardcover.....We ship daily from our Bookshop.
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19. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability Buy it!

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Pecht, Michael
author size:
USD
198.97
price size:
Lucky's Textbooks /Abebooks
dealer size:
ISBN10: 0471594466, ISBN13: 9780471594468, [publisher: Wiley-Interscience] Hardcover
[Dallas, TX, U.S.A.] [Publication Year: 1994]
description size:
20. Integrated Circuit Buy it!

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Pecht
author size:
USD
232.16
price size:
moluna /AbebooksDE
dealer size:
ISBN10: 0471594466, ISBN13: 9780471594468, [publisher: John Wiley & Sons] Hardcover Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this booka s microelectronic package design--for--reliability guidelines and approaches essential for achieving their life--cycle, cost--effectiveness, an.
[Greven, Germany] [Publication Year: 1994]
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21. Integrated Circuit Buy it!

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Pecht
author size:
USD
210.12
price size:
moluna /ZVAB
dealer size:
ISBN10: 0471594466, ISBN13: 9780471594468, [publisher: John Wiley & Sons] Hardcover Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this booka s microelectronic package design--for--reliability guidelines and approaches essential for achieving their life--cycle, cost--effectiveness, an.
[Greven, Germany] [Publication Year: 1994]
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22. Integrated Circuit a Focus on Reliability Buy it!

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M Pecht
author size:
USD
201.03
price size:
Paperbackshop International via Alibris /Alibris
dealer size:
John Wiley & Sons 3/16/1994 12: 00: 00 AM Hardcover PLEASE NOTE, WE DO NOT SHIP TO DENMARK. New Book. Shipped from UK in 4 to 14 days. Established seller since 2000. Please note we cannot offer an expedited shipping service from the UK.
description size:
23. Integrated Circuit A Focus on Reliability Buy it!

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M Pecht
author size:
USD
185.85
price size:
PBShop.store UK /AbebooksUK
dealer size:
ISBN10: 0471594466, ISBN13: 9780471594468, [publisher: John Wiley and Sons] Hardcover New Book. Shipped from UK. Established seller since 2000.
[Fairford, GLOS, United Kingdom] [Publication Year: 1994]
description size:
24. Integrated Circuit Hybrid and Multichip Module P Package Design Guidelines A Focus on Reliability Buy it!

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Michael Pecht
author size:
USD
263.11
price size:
Revaluation Books /Biblio
dealer size:
Wiley-Interscience, Date: 1994. Hardcover. New. second printing edition. 426 pages. 9.75x6.50x1.25 inches. 1994. Wiley-Interscience ISBN 0471594466 9780471594468 [GB]
description size:
25. Integrated Circuit, Hybrid, and Multichip Module P Package Design Guidelines – A Focus on Reliability Buy it!

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Michael Pecht
author size:
USD
267.57
price size:
Revaluation Books /AbebooksUK
dealer size:
ISBN10: 0471594466, ISBN13: 9780471594468, [publisher: Wiley-Interscience] Hardcover second printing edition. 426 pages. 9.75x6.50x1.25 inches. In Stock.
[Exeter, United Kingdom] [Publication Year: 1994]
description size:
26. Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability Buy it!

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Pecht, Michael
author size:
USD
238.88
price size:
Ria Christie Books via Alibris /Alibris
dealer size:
New York, NY Wiley-Interscience 1994 Hard cover New. Sewn binding. Cloth over boards. 464 p. Contains: Unspecified.
description size:

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